SA56004X
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7 25 February 2013
39 of 43
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Fig 28. PCB footprint for SOT782-1 (HVSON8); reflow soldering
SOT782-1
DIMENSIONS in mm
ootprint information for reflow soldering of HVSON8 package
Ay
By
D
SLx
SLy
SPx
SPy
Gx
Gy
3.25
2.2
P
0.65
0.3
C
0.525
2.45 1.65
1.1
0.65 3.25 3.25
Hy
3.5
nSPx nSPy
1
1
occupied area
solder land plus solder paste
solder land
solder paste deposit
sot782-1_fr
Issue date
12-02-09
12-02-28
Gy
Hy
C
SLx
Ay
By
SLy
Gx
D
P
nSPx
nSPy
SPy
SPx